TERMIUM Plus®

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beam-lead bonding [1 record]

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Alphabetical list of terms

Record 1 1992-11-09

English

Subject field(s)
  • Printed Circuits and Microelectronics

French

Domaine(s)
  • Circuits imprimés et micro-électronique
DEF

Technique d'interconnexion des circuits dans laquelle on fait croître, par pulvérisation ou par électrolyse, des contacts coplanaires allongés et suffisamment épais sur la face active de la puce, et qui permet de réaliser un soudage rapide et fiable de la puce sur le support de base d'un circuit hybride.

Spanish

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